Pack-ready materials
Thermal pads, UL94-rated foams and barrier films suited to compact EV battery and BMS integration.
Thermal pads, flame-retardant gap fillers and barrier films for BMS boards and lithium battery packs. We support 3 W/mK conductivity at the board, UL94 HF-1 rated foam for the stack-up, and polyester barrier films — all converted and die-cut to your pack drawing for OEM production.
A BMS board sits inside the pack, which means its ambient is already elevated before it dissipates anything of its own. Two requirements run in parallel and are easy to conflate. The first is a thermal path from the balancing FETs and current shunt into the pack wall. The second is a dielectric barrier keeping cell terminals, busbars and the enclosure apart — a mechanical and electrical job, not a thermal one.
The other thing that separates pack work from board work is tolerance. A welded or bonded pack stack accumulates real dimensional variation, so a thin, stiff pad will bridge in some places and leave air in others. A compressible gap filler that takes up that variation will outperform a harder pad with a better headline conductivity.
Flame behaviour also stops being optional inside a battery enclosure, which is why the foam we supply for this work carries a UL94 rating. We supply BMS and battery-pack thermal pads, gap fillers and insulation films, converted and die-cut to your pack drawings for OEM production.
Every BMS assembly solves the same two problems at once: moving a moderate, continuous heat load out of the board, and keeping live cell parts electrically and mechanically separated from everything around them.
The thermal job is conduction, not convection — a sealed pack has no airflow, so heat from the balancing FETs and the current shunt leaves through a pad into the pack wall. The barrier job belongs to a different material family entirely: polyester films die-cut to the cell footprint, used as wraps, spacers and busbar barriers. Specifying one material for both jobs is the most common pack-design mistake we see.
Start from the location, not the datasheet. The BMS board needs conduction; the uneven stack-up needs compression and flame-rated sealing; the cells and busbars need a dielectric barrier. The table below maps each location to the grade we supply for it.
| Where in the pack | Grade | Conductivity | Common thickness |
|---|---|---|---|
| BMS board — FETs, shunt | CP300 | 3.0 W/m·K | 0.5–3 mm |
| Uneven stack-up, sealing, vibration | MCF-PU | Not a TIM — UL94 HF-1 / HBF | 0.5–5 mm, custom |
| Cell wrap, busbar barrier | PET-FILM | Dielectric barrier | To drawing |
| Die-cut barrier parts | MYLAR-DC | Dielectric barrier | To drawing |
Inside a pack, gap fill beats headline conductivity. A compressible pad or foam that closes the gap across the whole area outperforms a harder, higher-conductivity part that leaves air behind — and air conducts almost nothing.
CP300 is supplied as sheet with or without adhesive backing, and every material below can be die-cut to your pack drawing. Technical datasheets are linked where one exists.
| Grade | Conductivity | Dielectric strength | Thickness options | Adhesive | Datasheet |
|---|---|---|---|---|---|
| CP300 | 3.0 W/m·K | 6.0 kV/mm | 0.5 / 1 / 2 / 3 mm | Adhesive or plain | TDS |
| Material | Description | Thickness | Datasheet |
|---|---|---|---|
| MCF-PU | Micro-cellular PU foam — UL94 HF-1 / HBF, −40 °C to +100 °C, high resilience (≥50 % set recovery) | 0.5 / 1 / 2 / 3 / 5 mm + custom | — |
| PET-FILM | Polyester film barrier — cell wraps, spacers and busbar barriers, die-cut to drawing | To drawing | TDS |
| MYLAR-DC | Die-cut Mylar (polyester) parts — slot liners, spacers and insulation barriers to drawing | To drawing | TDS |
MOQ 10 sheets · typically dispatched in 7 days.
Grades most often specified for BMS boards and battery pack assemblies, drawn from the live catalogue.
Supply terms. Standard sheet grades start at 10 sheets; die-cut TO-package shapes start at 50 pieces. Catalogue grades are typically dispatched within 7 days. Parts to a new drawing are quoted per job — send a DXF or PDF with the grade and thickness, and note that die cost is one-time, so the per-part price falls sharply with volume. Adhesive and non-adhesive options are available across the silicone grades. ISO 9001:2015, supplied to OEMs and contract manufacturers across India from Bengaluru.
Thermal pads, UL94-rated foams and barrier films suited to compact EV battery and BMS integration.
Conversion support for cut-outs, stack constraints, and non-uniform battery pack geometry.
Consistent repeat supply for pilot runs, production validation, and commercial ramp-up.
3 W/m·K (CP300) covers most BMS work — balancing FETs and shunts produce a moderate, continuous load rather than large peaks. Going higher rarely helps as much as making sure the pad actually fills the gap it is bridging.
Because pack stack-ups accumulate tolerance. A compressible micro-cellular foam takes up that variation and maintains contact across the whole area, where a thin stiff pad would touch in places and leave insulating air in others.
Yes — the micro-cellular PU foam we supply for pack work is rated UL94 HF-1 / HBF and is specified for −40 °C to +100 °C with high resilience, at least 50 % set recovery. It is a sealing, cushioning and vibration-isolation material, not a thermal interface.
Barrier films rather than thermal pads — polyester and PET die-cut to the cell footprint, used as wraps, spacers and busbar barriers. The requirement there is dielectric strength and mechanical robustness, not conduction.
Yes. Send a DXF or PDF and we quote against it. Pack parts are usually the clearest case for die cutting, because the shapes are irregular and repeat across every unit built.
Send your specification — grade, thickness, size or die-cut drawing, and quantity — and our team will quote to your requirement.