On-time delivery
Support for development builds, pilot quantities, and scheduled repeat supply.
Thermal pads and insulation films for computer hardware — VRM stages, SSD controllers, chipsets and heat-spreader assemblies. From SSD controllers and CPUs to GPUs and chipset-level heat spreaders, computer hardware needs dependable thermal interface materials that fit tightly, stay clean in assembly, and support stable heat transfer at low clamping force. We supply 1 to 2 W/m·K silicone pads from 0.5 mm, plus polyester insulation films, die-cut to your drawing for OEM production.
Computing hardware inverts the usual priorities. The dissipating parts — VRM stages, SSD controllers, chipsets and heat-spreader interfaces — are individually modest, but the space they sit in is tightly constrained and the clamping force is low. A pad here is typically held by a spring clip, a light bracket or the enclosure itself rather than a bolted joint, so it has to comply and make contact at a fraction of the pressure a power-electronics pad sees.
That makes thickness accuracy and softness matter more than a high headline conductivity. A pad a few tenths of a millimetre too thick will bow a board or stop an enclosure closing, and one slightly too thin leaves an air gap that undoes the whole point — air conducts almost nothing, so even a partial gap dominates the thermal resistance of the joint.
Assemblies are also z-height budgeted to a degree other industries are not, so the useful question is usually the thinnest section that still fills the gap reliably, rather than the highest conductivity available. Getting that call right keeps VRM and controller temperatures inside rating without disturbing the mechanical stack-up the enclosure was designed around.
We supply computer thermal pads and insulation films to your specification — cut, die-cut, and converted for OEM assembly lines.
Heat from a VRM stage or SSD controller leaves through the component case, crosses the interface into a heat spreader or shield, and only then reaches the enclosure and ambient air. Every interface on that road adds resistance — and the one most often left to an air gap is the pad.
Most of the layers are fixed before the pad is ever chosen: the die, the package, the spreader and the enclosure geometry are set by the board and the case design. The interface is the one layer left open, and because clamping force is low, the pad has to wet out both surfaces at a fraction of the pressure a bolted power device would apply. A soft, accurately gauged silicone thermal pad in that gap cuts interface resistance sharply compared with still air.
Alongside the thermal path, the same assemblies need dielectric barriers — Mylar and PET film parts that keep live traces, shields and chassis apart. Those are a separate material family, specified to drawing rather than by conductivity.
Start from the measured gap and the clamping arrangement, not from the catalogue's largest conductivity figure. The table below maps the common locations in a computer assembly to the grades we supply for them.
| Location | Grade | Conductivity | Common thickness |
|---|---|---|---|
| VRM, chipset, general board level | CP200 | 2.0 W/m·K | 0.5–3 mm |
| Low-power, tight z-height | CP100 | 1.0 W/m·K | 0.5–1 mm |
| Die-cut barrier and liner parts | MYLAR-DC | Dielectric barrier | To drawing |
| Spacers, insulating liners | PET-FILM | Dielectric barrier | To drawing |
In a clipped, z-height-limited assembly, filling the gap reliably beats a higher conductivity figure. Specify from the measured gap plus a little compression, and let a compliant pad do the work.
Both silicone grades are supplied as sheet with or without adhesive backing, and every grade can be die-cut to your drawing. Technical datasheets are linked per grade; the full silicone range is in the thermal catalogue.
| Grade | Conductivity | Dielectric strength | Thickness options | Adhesive | Datasheet |
|---|---|---|---|---|---|
| CP100 | 1.0 W/m·K | 4.0 kV/mm | 0.5 / 1 / 2 / 3 mm | Adhesive or plain | TDS |
| CP200 | 2.0 W/m·K | 5.0 kV/mm | 0.5 / 1 / 2 / 3 mm | Adhesive or plain | TDS |
Mylar and PET film parts handle the dielectric side of the assembly — barriers, liners and spacers cut to the exact footprint. Full ranges are in the insulation paper catalogue.
Grades most often specified for computer hardware assemblies, drawn from the live catalogue.
Supply terms. Standard sheet grades start at 10 sheets; die-cut TO-package shapes start at 50 pieces. Catalogue grades are typically dispatched within 7 days. Parts to a new drawing are quoted per job — send a DXF or PDF with the grade and thickness, and note that die cost is one-time, so the per-part price falls sharply with volume. Adhesive and non-adhesive options are available across the silicone grades. ISO 9001:2015, supplied to OEMs and contract manufacturers across India from Bengaluru.
Support for development builds, pilot quantities, and scheduled repeat supply.
Stable thermal materials chosen for board-level consistency and dependable conversion.
Fast RFQ support for custom dimensions, sheet formats, and package-ready parts.
Match the measured gap plus a little compression. 0.5 mm and 1 mm cover most board-to-shield and board-to-spreader gaps; go thicker only where the stack-up genuinely calls for it. Too thick bows the board or stops the case closing.
Usually thickness. Filling the gap reliably with a compliant pad beats a higher-conductivity pad that leaves air behind, because air is a far worse conductor than any grade in the range.
Because pads held by a clip or the enclosure never see the pressure a bolted power device applies. A softer pad that conforms at low force makes better real contact than a harder, nominally better one.
Yes — thin die-cut parts to your drawing are routine, including irregular outlines and cut-outs around components.
Treat them as single-use. Once a pad has taken a set against a component it will not re-conform the same way, and reusing it gives inconsistent contact. For rework, fit a fresh part.
Send your specification — grade, thickness, size or die-cut drawing, and quantity — and our team will quote to your requirement.